BGA-Top-284 ZIF (a)
(Ord. no. 70-2635A)
- special adapter, assigned for eMMC devices in BGA package
- designed for TurboMode
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- made in Slovakia
|
Ord. no. | 70-2635A |
Socket | ZIF BGA153, OpenTop type |
Connection to BGA-Bottom-X | 4x25 pins, square, 0.6x0.6mm |
Class | BGA/LGA |
Subclass | BGA-Top |
Availability in stock | 15 pcs. [other 40 pcs. within 3 days] |
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-284 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
See
this brochure for details on proper package loading procedure
