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Elnec
BGA-Bottom-327 ( Ord. No. : 70-3110 ) + BGA-Top-284 ZIF (a) ( Ord. No. : 70-2635A ) soket seti
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765,00 USD + KDV
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:
902,70 USD
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BGA-Bottom-327
(Ord. no. 70-3110)- bottom board of BGA adapters, assigned for eMMC devices (e.g. THGBMBG7D2KBAIL, KLM4G1FEAC-B031000) in matrix 14x14-8x8, 6x6-4x4
- supported from PG4UW software version 3.07z09
- made in Slovakia
Ord. no. 70-3110 Connection to BGA-Top-X 4x25 sockets for wire wrap pin Bottom 2x24 pins, square, 0.6x0.6mm, rows spacing 600mil Class BGA/LGA Subclass BGA-Bottom Adapter manual
- Protect the contacts of adapter connectors from contamination. Any dirt and/or fat on contacts may cause errors during programming.
- For work with BGA device it is necessary put together BGA-Bottom-X with some BGA-Top-X board according to the information provided by PG4UW software.
- Operating conditions: temperature 5°C ÷ 40°C (41°F ÷ 104°F), humidity 20% ÷ 80% non-condensing.
BGA-Top-284 ZIF (a)
(Ord. no. 70-2635A)- special adapter, assigned for eMMC devices in BGA package
- designed for TurboMode
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball height and body thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operating (mechanical) warranty of ZIF socket - 10,000 actuations
- made in Slovakia
Ord. no. 70-2635A Socket ZIF BGA153, OpenTop type Connection to BGA-Bottom-X 4x25 pins, square, 0.6x0.6mm Class BGA/LGA Subclass BGA-Top Adapter manual
- For work with BGA device it is necessary put together BGA-Top-284 ZIF (a) with some BGA-Bottom-X board according to the information provided by PG4UW software.
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
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